PWA09 Platelet Calcined Alumina powder
The alumina purity of the platelet alumina is more than 99%, and it has the characteristics of heat resistance, acid and alkali corrosion resistance and high hardness. Different from the traditional abrasive spherical particles, the bottom surface of the flat alumina is flat, and the particles fit the surface of the workpiece during grinding, which produces a sliding grinding effect, which avoids the sharp corners of the particles from scratching the surface of the workpiece. On the other hand, the plate alumina in grinding, the grinding pressure is evenly distributed on the surface of the particles, the particles are not easily broken, and the wear resistance is improved, thereby improving the grinding efficiency and surface finish.
PWA is a white calcined alumina abrasive powder consisting of plate-shaped crystals of aluminum oxide (Al2O3) with a purity of over 99.0%.
- Chemically inert
- Will not be corroded by either acids or alkalines
- Excellent heat-resistant properties
- Greater number of uniform grades than available from most manufacturers
The particle size distribution is tightly controlled and produces a very fine lapped surface allowing a wide range of applications, such as:
- Lapping agent for:
- Silicon
- Optical materials
- Liquid crystal
- Stainless steel
- Other materials
- Filler material for coatings
- Material for lapping cloth or paper
- Compounding agent combined with a metal or synthetic resin
| Particle Size | Particle Distribution (µm) | Notes | |||
| Maximum Particle Size | Particle Size at d03 | Particle Size at d50 | Particle Size at d94 | ||
| 45 | < 82.9 | 53.4 ± 3.20 | 34.9 ± 2.30 | 22.8 ± 1.80 | Discontinued |
| WCA40 | < 77.8 | 41.8 ± 2.80 | 29.7 ± 2.00 | 19.0 ± 1.00 | |
| WCA35 | < 64.0 | 37.6 ± 2.20 | 25.5 ± 1.70 | 16.0 ± 1.00 | |
| WCA30 | < 50.8 | 30.2 ± 2.10 | 20.8 ± 1.50 | 14.5 ± 1.10 | |
| WCA25 | < 40.3 | 26.3 ± 1.90 | 17.4 ± 1.30 | 10.4 ± 0.80 | |
| WCA20 | < 32.0 | 22.5 ± 1.60 | 14.2 ± 1.10 | 9.00 ± 0.80 | |
| WCA15 | < 25.4 | 16.0 ± 1.20 | 10.2 ± 0.80 | 6.30 ± 0.50 | |
| WCA12 | < 20.2 | 12.8 ± 1.00 | 8.20 ± 0.60 | 4.90 ± 0.40 | |
| WCA9 | < 16.0 | 9.70 ± 0.80 | 6.40 ± 0.50 | 3.60 ± 0.30 | |
| WCA5 | < 12.7 | 7.20 ± 0.60 | 4.70 ± 0.40 | 2.80 ± 0.25 | |
| WCA3 | < 10.1 | 5.20 ± 0.40 | 3.10 ± 0.30 | 1.80 ± 0.30 | |
For semiconductor materials such as semiconductor silicon wafers, the application of plate aluminum oxide can reduce the grinding time, greatly improve the grinding efficiency, reduce the loss of the grinding machine, save labor and grinding costs, and increase the grinding pass rate. The quality is close to well-known foreign brands.
The work efficiency of the glass bulb grinding of the picture tube is increased by 3-5 times;
The qualified product rate is increased by 10-15%, and the qualified product rate of semiconductor wafers reaches more than 99%;
Grinding consumption is 40-40% less than ordinary alumina polishing powder;
Chemical composition—Platelet Calcined Alumina powder
The alumina purity of the platelet alumina is more than 99%, and it has the characteristics of heat resistance, acid and alkali corrosion resistance and high hardness. Different from the traditional abrasive spherical particles, the bottom surface of the flat alumina is flat, and the particles fit the surface of the workpiece during grinding, which produces a sliding grinding effect, which avoids the sharp corners of the particles from scratching the surface of the workpiece. On the other hand, the plate alumina in grinding, the grinding pressure is evenly distributed on the surface of the particles, the particles are not easily broken, and the wear resistance is improved, thereby improving the grinding efficiency and surface finish.
PWA is a white calcined alumina abrasive powder consisting of plate-shaped crystals of aluminum oxide (Al2O3) with a purity of over 99.0%.
- Chemically inert
- Will not be corroded by either acids or alkalines
- Excellent heat-resistant properties
- Greater number of uniform grades than available from most manufacturers
The particle size distribution is tightly controlled and produces a very fine lapped surface allowing a wide range of applications, such as:
- Lapping agent for:
- Silicon
- Optical materials
- Liquid crystal
- Stainless steel
- Other materials
- Filler material for coatings
- Material for lapping cloth or paper
- Compounding agent combined with a metal or synthetic resin
| Particle Size | Particle Distribution (µm) | Notes | |||
| Maximum Particle Size | Particle Size at d03 | Particle Size at d50 | Particle Size at d94 | ||
| 45 | < 82.9 | 53.4 ± 3.20 | 34.9 ± 2.30 | 22.8 ± 1.80 | Discontinued |
| WCA40 | < 77.8 | 41.8 ± 2.80 | 29.7 ± 2.00 | 19.0 ± 1.00 | |
| WCA35 | < 64.0 | 37.6 ± 2.20 | 25.5 ± 1.70 | 16.0 ± 1.00 | |
| WCA30 | < 50.8 | 30.2 ± 2.10 | 20.8 ± 1.50 | 14.5 ± 1.10 | |
| WCA25 | < 40.3 | 26.3 ± 1.90 | 17.4 ± 1.30 | 10.4 ± 0.80 | |
| WCA20 | < 32.0 | 22.5 ± 1.60 | 14.2 ± 1.10 | 9.00 ± 0.80 | |
| WCA15 | < 25.4 | 16.0 ± 1.20 | 10.2 ± 0.80 | 6.30 ± 0.50 | |
| WCA12 | < 20.2 | 12.8 ± 1.00 | 8.20 ± 0.60 | 4.90 ± 0.40 | |
| WCA9 | < 16.0 | 9.70 ± 0.80 | 6.40 ± 0.50 | 3.60 ± 0.30 | |
| WCA5 | < 12.7 | 7.20 ± 0.60 | 4.70 ± 0.40 | 2.80 ± 0.25 | |
| WCA3 | < 10.1 | 5.20 ± 0.40 | 3.10 ± 0.30 | 1.80 ± 0.30 | |
For semiconductor materials such as semiconductor silicon wafers, the application of plate aluminum oxide can reduce the grinding time, greatly improve the grinding efficiency, reduce the loss of the grinding machine, save labor and grinding costs, and increase the grinding pass rate. The quality is close to well-known foreign brands.
The work efficiency of the glass bulb grinding of the picture tube is increased by 3-5 times;
The qualified product rate is increased by 10-15%, and the qualified product rate of semiconductor wafers reaches more than 99%;
Grinding consumption is 40-40% less than ordinary alumina polishing powder;
Chemical composition Platelet Calcined Alumina powder
| Al2O3 | ≥99.0% |
| SiO2 | <0.2 |
| Fe2O3 | <0.1 |
| Na2O | <1 |
Physical properties
| Material | α-Al2O3 |
| Color | White |
| Specific gravity | ≥3.9g/cm3 |
| Mohs’Hardness | 9.0 |
Product application range: Platelet Calcined Alumina powder
1) Electronics industry: grinding and polishing of semiconductor monocrystalline silicon wafers, quartz quartz crystals, compound semiconductors (crystalline gallium, phosphating nano).
2) Glass industry: grinding and processing of crystal, quartz glass, kinescope glass shell screen, optical glass, liquid crystal display (LCD) glass substrate, and quartz crystal.
3) Coating industry: special coatings and fillers for plasma spraying.
4) Metal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-grade high-temperature coatings, etc.
Package:10kgs/bag,20kgs/ Carton
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| Al2O3 | ≥99.0% |
| SiO2 | <0.2 |
| Fe2O3 | <0.1 |
| Na2O | <1 |
Physical properties
| Material | α-Al2O3 |
| Color | White |
| Specific gravity | ≥3.9g/cm3 |
| Mohs’Hardness | 9.0 |
Product application range:Platelet Calcined Alumina powder
1) Electronics industry: grinding and polishing of semiconductor monocrystalline silicon wafers, quartz quartz crystals, compound semiconductors (crystalline gallium, phosphating nano).
2) Glass industry: grinding and processing of crystal, quartz glass, kinescope glass shell screen, optical glass, liquid crystal display (LCD) glass substrate, and quartz crystal.
3) Coating industry: special coatings and fillers for plasma spraying.
4) Metal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-grade high-temperature coatings, etc.
Package:10kgs/bag,20kgs/ Carton
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